Stock Code
600478
600478
Electromagnetic shielding material - tin-plated PI film, with PI film as the substrate, metal copper and tin are plated respectively by magnetron sputtering and electrodeposition, combining the substrate’s excellent high and low temperature resistance with good electrical conductivity and weldability.
1. High temperature resistance and excellent conductivity;
2. Easy to die-cut and assemble;
3. Good coating adhesion.
Consultation Hotline：
0736-2585759
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Product name |
Product parameters |
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Tin-plated PI film |
Product number |
Appearance |
Substrate thickness (mm) |
Copper plating thickness (mm) |
Tin plating thickness (mm) |
Width (mm) |
Solderability test |
Metal coating adhesion (kgf/15 mm2) |
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TF0125** |
Silver gray |
0.025 |
0.0010-0.0030 |
0.0015-0.0035 |
250 |
＞ 95% wetting |
≥0.6 |
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TF0150** |
0.050 |
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Appearance: Uniform coating, consistent color, and neatly rolled strip |
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Lithium